Computer On Modules
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- Supports iManager, WISE-DeviceOn and Embedded Software APIs
- Triple Display (DP++, HDMI, LVDS)
- Dual Channel up to 16GB LPDDR4 3200MT/s and IBECC supported by specific SKUs
- Onboard storage eMMC up to 64GB
- Dual LAN with TSN Support
- SMARC2.0 & SMARC2.1 Compliance
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- 5th Gen Intel® Core™ / Celeron Processors U Series (SoC)
- Supports Dual Channel DDR3L 1600 SODIMM sockets up to 16 GB
- Supports 3 independent displays: VGA, LVDS, HDMI/DisplayPort/DVI
- Supports resolutions up to 4096 x 2304 (4K2K) @ 60 Hz
- Supports iManager, SUSIAccess and Embedded Software APIs
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- 6th Gen Intel Core i7/i5/i3/Celeron w/ integrated PCH-LP
- Support Dual Channel DDR3L 1600 SODIMM up to 16GB(Socket 1 on top, Socket 2 on bottom)
- 3 independent displays: LVDS/Display Port/HDMI/VGA
- Supports iManager SUSIAccess, and Embedded Software APIs
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- 7th Gen Intel Core i7/i5/i3/Celeron w/ integrated PCH-LP
- Support Dual Channel DDR4 2133 SODIMM up to 32GB
- Integrated GFx supports HEVC, VP8, VP9 HW Transcode
- Flexible PCI Express up to 8 lanes
- Supports iManager, WISE-PaaS/RMM, and Embedded Software APIs
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- On board storage eMMC up to 64GB, TPM2.0
- High speed I/O: 4 USB3.1 (Gen2), 6 PCIe X1 (Gen3), 4 SATA (Gen3)
- Intel® 8th Gen Core Processors Product Family with Dual channel DDR4 Max 32GB memory
- Supports SUSI, DeviceOn and Edge AI Suite
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- 11th Generation Intel® Core™ Processor U-Series
- COM Express R3.0 Compact Module Type 6 Pinout
- Dual channel with one memory down and one SODIMM
- High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
- Onboard NVMe x4 SSD up to 64GB, TPM2.0
- Supports SUSI, DeviceOn and Edge AI Suite
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- AMD Embedded Ryzen 7nm SoC – V2000 APU
- COM Express® R3.0 Compact Module Type 6 Pinout
- Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
- High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
- Four Display (DP++, HDMI, VGA, LVDS)
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
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- Intel® Xeon® D-2100 Processor Product Family
- COM-HPC® Server Size E Module
- 16 Cores, 32 Threads, 100W TDP
- Dual Channel DDR4 RDIMM/LRDIMM, max. 512GB (Both ECC & Non-ECC)
- High Speed I/Os: 2 USB3.0, 2 PCIe x16 Gen3, 15 PCIe x1 Gen3 (1 for BMC), and 2 SATA3.0
- High speed Ethernet (4 10GBASE-KR interfaces, one GbE)
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
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- Supports 4th Generation Intel® Core™ i3/i5/i7 processors and Intel® QM87 PCH with embedded graphic (up to 3 independent displays)
- Up to 16GB (DDR3 1600) low voltage ECC memory (max 8GB on board, socket SO-UDIMM x1, max 8GB)
- Optimized single-slot SBC with 2.5" SATA-III HDD/CFast socket/ on-board flash (optional)
- Two SATA ports, 1x USB 3.0, four USB 2.0 ports, two DVI ports, two RS-232 ports, one PS/2 connector, and PCIe x8 interfaces to the Rear Transition Module (RTM)
- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity
- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant
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- Supports 22nm Intel® Xeon® processor
- Intel® DH8900 chipset supports DM1.0 x 4
- Up to 16GB DDR3-1333/1600 ECC memory
- Supports up to five GbE ports, six USB2.0 ports, two VGA ports,three COM ports, one PS/2 connector, three 2.5" SATA connector (one SATA HDD is optional with 8GB NAND flash), one Cfast, one PCIe 2.0x4 interface to the Rear Transition Module (RTM)
- PICMG2.0 R3.0, PICMG2.1 R.0, PICMG2.16 R1.0 Compliant